Comments on: TSMC Makes The Best Of A Tough Chip Situation https://www.nextplatform.com/2023/10/25/tsmc-makes-the-best-of-a-tough-chip-situation/ In-depth coverage of high-end computing at large enterprises, supercomputing centers, hyperscale data centers, and public clouds. Tue, 07 Nov 2023 18:12:15 +0000 hourly 1 https://wordpress.org/?v=6.7.1 By: JayN https://www.nextplatform.com/2023/10/25/tsmc-makes-the-best-of-a-tough-chip-situation/#comment-215551 Thu, 26 Oct 2023 02:40:04 +0000 https://www.nextplatform.com/?p=143152#comment-215551 “All of those older nodes have plenty of use – a lesson that Intel forgot…”
Intel’s recent chips are using tiles built on different processes… some tiles on TSM EUV and some on Intel DUV. Their base tile on Meteor Lake is reported to be 22FFL.

These have been in design for a few years, so it isn’t like they just remembered…

]]> By: Hubert https://www.nextplatform.com/2023/10/25/tsmc-makes-the-best-of-a-tough-chip-situation/#comment-215540 Wed, 25 Oct 2023 21:59:42 +0000 https://www.nextplatform.com/?p=143152#comment-215540 Good to see TSMC coming out of that Q2 “What The Heck???” trough (TNP 07/21/23) with most indicators now nicely up! Hopefully they make that 3,500 1K-12″-eqs wafer shipments foretold by 8^q (unusual name)’s non-AI crystal ball incantations by the Q4 report in Jan ’24 (if only to demonstrate the awesome power of the non-AI metaphysical mind! eh-eh-eh).

]]>